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WanYing semiconductor packaging and testing facility


Advancedfast Packaging
Superior Performance

Enabling the Future of Semiconductor Innovation.
High Speed • High Density • High Reliability
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QFN 2x2 14L semiconductor package outline


Advanced Semiconductor Packaging and Test Solutions

One-stop service from design simulation to reliability testing, accelerating your time-to-market.
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RF-SiP packaging solution for compact RF systems


Design the Future,
Simulate with Confidence

Advanced Semiconductor Design and Simulation Solutions. 
Chip Design • Circuit Simulation • Multi-Physics Analysis • High Performance
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Our Core Technologies

High Precision. High Integration. High Reliability.
One-stop Solution
Design and Simulation
Packaging Manufacturing
Reliability and Failure Analysis
One-stop Solution

One-stop Solution

We are not only a professional integrated circuit packaging provider, but also your technical partner from design to mass production.Facing diverse application demands and rigorous technical challenges,we offer fully-customized solutions that cover the entire process while balancing flexibility and depth,ensuring your product achieves optimal performance and maximum reliability from concept to market.
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Design and Simulation

Design and Simulation

Outstanding performance begins with precise design and simulation. Our design team, with over 30 years of industry experience, is proficient in the design principles and implementation solutions for various advanced packaging technologies. We provide end-to-end collaborative services, from front-end solution design to multi-physics simulation, enabling early detection and resolution of potential issues through virtual validation. This approach significantly enhances development efficiency and accelerates your product’s time-to-market.
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Packaging Manufacturing

Packaging Manufacturing

With over three decades of technical expertise and continuous innovation, we have established three highly specialized, process-automated core packaging production lines and remain committed to advancing the frontiers of advanced packaging technologies. We are dedicated to providing customers with comprehensive solutions ranging from traditional high-reliability packaging to cutting-edge system-level integration. Having successfully supported hundreds of critical projects, we have become a trusted partner in the field of high-end chip packaging.
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Reliability and Failure Analysis

Reliability and Failure Analysis

We have established an industry-leading one-stop testing and analysis platform that not only ensures every product leaving the factory meets the most stringent standards but also drives continuous optimization of design and processes through in-depth failure mechanism analysis, safeguarding the full lifecycle reliability of our clients' products.
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Product Center

Leadframe Package
Leadframe Package
Design & Simulation
Design & Simulation
D(igital)-SiP
D(igital)-SiP
MEMS/Sensor Package
MEMS/Sensor Package
Chiplet
Chiplet
Cerimic/Metal Package
Cerimic/Metal Package

Leadframe Package
Leadframe Package
Leadframe Package

Leadframe Package
Leadframe packaging is cost-effective mainstream non-hermetic tech for mass production across consumer, auto and industrial electronics. The Leadframe Package provides a cost-effective and reliable semiconductor packaging solution, supporting high-volume manufacturing and integration for consumer, automotive, and industrial sectors with advanced QFN packaging expertise.
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QFN5X5-20L
QFN5X5-20L
QFN5X5-20L

QFN5X5-20L
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QFN4X4-32L
QFN4X4-32L
QFN4X4-32L

QFN4X4-32L
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QFN4X4-20L
QFN4X4-20L
QFN4X4-20L

QFN4X4-20L
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QFN4X4-16L
QFN4X4-16L
QFN4X4-16L

QFN4X4-16L
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QFN3X4-24L
QFN3X4-24L
QFN3X4-24L

QFN3X4-24L
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QFN3X3-24L
QFN3X3-24L
QFN3X3-24L

QFN3X3-24L
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QFN3X3-20L
QFN3X3-20L
QFN3X3-20L

QFN3X3-20L
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QFN3X3-16L
QFN3X3-16L
QFN3X3-16L

QFN3X3-16L
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QFN2X2-14L
QFN2X2-14L
QFN2X2-14L

QFN2X2-14L
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DRQFN11X11-156L
DRQFN11X11-156L
DRQFN11X11-156L

DRQFN11X11-156L
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DRQFN8X8-100L
DRQFN8X8-100L
DRQFN8X8-100L

DRQFN8X8-100L
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DFN8X8-8L
DFN8X8-8L
DFN8X8-8L

DFN8X8-8L
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DFN8X6-8L
DFN8X6-8L
DFN8X6-8L

DFN8X6-8L
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DFN5X5-4L
DFN5X5-4L
DFN5X5-4L

DFN5X5-4L
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DFN3X3-10L
DFN3X3-10L
DFN3X3-10L

DFN3X3-10L
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DFN3X3-8L
DFN3X3-8L
DFN3X3-8L

DFN3X3-8L
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DFN3X2-8L
DFN3X2-8L
DFN3X2-8L

DFN3X2-8L
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DFN2X2-6L
DFN2X2-6L
DFN2X2-6L

DFN2X2-6L
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DFN1.5X1.5-6L
DFN1.5X1.5-6L
DFN1.5X1.5-6L

DFN1.5X1.5-6L
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LQFP20X20-144L
LQFP20X20-144L
LQFP20X20-144L

LQFP20X20-144L
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LQFP14X14-128L
LQFP14X14-128L
LQFP14X14-128L

LQFP14X14-128L
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LQFP14X14-100L
LQFP14X14-100L
LQFP14X14-100L

LQFP14X14-100L
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SOT89-3L
SOT89-3L
SOT89-3L

SOT89-3L
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SOT23-5L
SOT23-5L
SOT23-5L

SOT23-5L
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TSSOP28L
TSSOP28L
TSSOP28L

TSSOP28L
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TSSOP24L
TSSOP24L
TSSOP24L

TSSOP24L
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TSSOP20L
TSSOP20L
TSSOP20L

TSSOP20L
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TSSOP18L
TSSOP18L
TSSOP18L

TSSOP18L
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TSSOP16L
TSSOP16L
TSSOP16L

TSSOP16L
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SOP48L
SOP48L
SOP48L

SOP48L
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SOP32L
SOP32L
SOP32L

SOP32L
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SOP28L
SOP28L
SOP28L

SOP28L
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SOP20L
SOP20L
SOP20L

SOP20L
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SOP16L
SOP16L
SOP16L

SOP16L
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SOP14L
SOP14L
SOP14L

SOP14L
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SOP8L
SOP8L
SOP8L

SOP8L
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QFN12X12-100L
QFN12X12-100L
QFN12X12-100L

QFN12X12-100L
The QFN12X12-100L offers a compact 12mm × 12mm footprint with 100 leads, delivering advanced surface-mount performance and reliability. Ideal for complex designs, this qfn packaging solution ensures efficient thermal and electrical management.
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QFN10X10-96L
QFN10X10-96L
QFN10X10-96L

QFN10X10-96L
The QFN10X10-96L is a compact and high-density qfn package with 96 leads on a 10x10 mm footprint, offering superior electrical and thermal performance. A reliable solution from a trusted semiconductor packaging manufacturer.
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QFN10X10-88L
QFN10X10-88L
QFN10X10-88L

QFN10X10-88L
The QFN10X10-88L offers a compact 10mm x 10mm footprint with 88 leads, delivering robust signal integrity and thermal management. This qfn package suits high-density, cost-effective designs from a reliable semiconductor packaging manufacturer.
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QFN9X9-80L
QFN9X9-80L
QFN9X9-80L

QFN9X9-80L
The QFN9X9-80L is a compact 9x9 mm qfn package with 80 leads, optimized for high-density circuits. As a reliable qfn packaging solution from a trusted semiconductor packaging manufacturer, it supports automated assembly for efficient electronics integration.
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QFN9X9-64L
QFN9X9-64L
QFN9X9-64L

QFN9X9-64L
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QFN8X8-64L
QFN8X8-64L
QFN8X8-64L

QFN8X8-64L
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QFN7X7-60L
QFN7X7-60L
QFN7X7-60L

QFN7X7-60L
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QFN6X6-56L
QFN6X6-56L
QFN6X6-56L

QFN6X6-56L
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QFN7X7-48L
QFN7X7-48L
QFN7X7-48L

QFN7X7-48L
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QFN6X6-48L
QFN6X6-48L
QFN6X6-48L

QFN6X6-48L
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QFN6X6-40L
QFN6X6-40L
QFN6X6-40L

QFN6X6-40L
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QFN5X5-48L
QFN5X5-48L
QFN5X5-48L

QFN5X5-48L
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QFN5X5-32L
QFN5X5-32L
QFN5X5-32L

QFN5X5-32L
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PPAK5X6
PPAK5X6
PPAK5X6

PPAK5X6
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PMFA-36
PMFA-36
PMFA-36

PMFA-36
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PMFA-23
PMFA-23
PMFA-23

PMFA-23
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DPAK
DPAK
DPAK

DPAK
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TOLL-8
TOLL-8
TOLL-8

TOLL-8
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TO263-7L
TO263-7L
TO263-7L

TO263-7L
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TO252-4L
TO252-4L
TO252-4L

TO252-4L
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TO247-4L
TO247-4L
TO247-4L

TO247-4L
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TO247-3L
TO247-3L
TO247-3L

TO247-3L
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TO220-5L
TO220-5L
TO220-5L

TO220-5L
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TO220-3L
TO220-3L
TO220-3L

TO220-3L
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EPLQFP20X20-144L
EPLQFP20X20-144L
EPLQFP20X20-144L

EPLQFP20X20-144L
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MSOP10L
MSOP10L
MSOP10L

MSOP10L
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EPTSSOP20
EPTSSOP20
EPTSSOP20

EPTSSOP20
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EMSOP8
EMSOP8
EMSOP8

EMSOP8
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LQFP32X32-240L
LQFP32X32-240L
LQFP32X32-240L

LQFP32X32-240L
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LQFP20X20-176L
LQFP20X20-176L
LQFP20X20-176L

LQFP20X20-176L
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Design & Simulation
Design & Simulation
Design & Simulation

Design & Simulation
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D(igital)-SiP
D(igital)-SiP
D(igital)-SiP

D(igital)-SiP
D-SiP leverages 2.5D/3D packaging to densely integrate various chips for Chiplet designs, with full-chain professional manufacturing services. D-SiP delivers advanced sip system in package solutions with high-density integration of AI, CPU, GPU, and memory chips. Our semiconductor packaging manufacturer offers precision manufacturing and full-chain services for complex microsystems.
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RF-SiP
RF-SiP
RF-SiP

RF-SiP
We specialize in high-density RF system integration, addressing key challenges such as crosstalk, structural resonance, interconnects, and heat dissipation. Backed by expertise in design, simulation, manufacturing, and testing, we deliver reliable and high-quality RF integration solutions for compact RF systems.
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WB (Wire Bond)
WB (Wire Bond)
WB (Wire Bond)

WB (Wire Bond)
Cost-effective mature wire bonding links chips widely for diverse packaging applications.
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FC (Flip Chip)
FC (Flip Chip)
FC (Flip Chip)

FC (Flip Chip)
Flip-chip packaging features short interconnection for superior high-speed & thermal performance for advanced chips. The Flip Chip (FC) packaging solution leverages advanced packaging technology for reduced interconnect length and superior thermal dissipation, integrating with semiconductor packaging materials and offering precise substrate design ideal for high-performance IC packaging suppliers.
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2.5/3D Package
2.5/3D Package
2.5/3D Package

2.5/3D Package
We provide customized high-end 2.5D/3D packaging for high-density hybrid multi-chip integration. The 2.5D/3D Package offers advanced multi-chip integration capabilities for compact, high-performance electronics. This sip system in package ensures optimized thermal and signal management by a leading semiconductor packaging manufacturer.
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BGA/LGA/PGA
BGA/LGA/PGA
BGA/LGA/PGA

BGA/LGA/PGA
We provide customized BGA/LGA/PGA interconnect packaging with distinct merits for processors, servers and aerospace chips. Our customized BGA/LGA/PGA solutions offer precise interconnect reliability with advanced packaging technology, ideal for demanding semiconductor packaging materials in processors and aerospace applications.
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MEMS/Sensor Package
MEMS/Sensor Package
MEMS/Sensor Package

MEMS/Sensor Package
We provide custom high-quality MEMS & sensor packaging for cryogenic, special-structured, integrated and array sensors.
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Chiplet
Chiplet
Chiplet

Chiplet
We deliver full-cycle 2.5D/3D Chiplet packaging to densely integrate various high-performance chips with reliable quality. Our advanced Chiplet solution employs 2.5D/3D microelectronics packaging to integrate diverse high-performance chips, offering scalable, flexible architectures with expert support from a leading chip packaging service provider.
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Cerimic/Metal Package
Cerimic/Metal Package
Cerimic/Metal Package

Cerimic/Metal Package
Hermetic packaging with metal/ceramic/glass delivers superior reliability for high-reliability microelectronic applications. The Cerimic/Metal Package offers hermetic protection using metal, ceramic, and glass materials to ensure enhanced reliability for sensitive microelectronic devices, incorporating advanced packaging expertise and inert gas sealing.
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Industry Applications

To date, the company has served over a hundred clients across various cutting-edge fields, including communications, biomedical, artificial intelligence, consumer electronics, automotive electronics, and industrial manufacturing.
01
Automotive
02
Aerospace & Defense
03
Telecom Infrastructure
Automotive
One-stop automotive microsystem services from integration to failure analysis, supporting ADAS and in-vehicle computing to meet AEC-Q100 reliability.
Aerospace & Defense
Radiation-hardened and hermetic microsystem solutions for extreme environments, covering design to failure analysis to ensure space and military mission reliability.
Telecom Infrastructure
One-stop microsystem services for 5G/6G and optical communications, focusing on signal integrity, power management, and thermal design for stable infrastructure operation.

Why Choose Us?
Wanying Microelectronics

From front-end conceptual design to back-end volume delivery, we ensure precision and control at every stage with our professional technical expertise, providing solid guarantees for the performance realization and reliability of our customersproducts.
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30+
30+
Years Experience
5+
5+
Quality System
99.8%
99.8%
Avg. Yield

Professional Certificates

We firmly adheres to the concept of compliance, ensuring every product is reliable and safe to use.
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News & Events

Stay updated on our technology advancements, company news, and industry perspectives.
Innovation Breakthrough! In-house Die Sorting Technology Implemented, Intelligent Upgrade Drives Production Capacity Leap,MY SHOP

Innovation Breakthrough! In-house Die Sorting Technology Implemented, Intelligent Upgrade Drives Production Capacity Leap - 2026 Jan
We are pleased to share a milestone achievement in technological innovation—after persistent efforts by our engineering team, we have successfully independently developed a high-efficiency die sorting function on existing equipment platforms. For the first time, we have realized a fully automated die sorting process from blue film to vacuum release boxes, marking a substantial breakthrough in our packaging process optimization!
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The "Art" of Stress: How Simulations Foresee the "Fractured" Future in the Microcosm of Chips,MY SHOP

The "Art" of Stress: How Simulations Foresee the "Fractured" Future in the Microcosm of Chips - 2025 Dec
At 7 a.m., your phone alarm rings on time. As you drowsily press the stop button, you likely never imagine the invisible mechanical battle unfolding inside the smooth, flat device in your hand. The chip and its packaging structure are subjected to complex mechanical stresses
READ MORE
Wanying Microelectronics' Path of Exploration in 2025: Thirteen Major Events, Advancing Together,MY SHOP

Wanying Microelectronics' Path of Exploration in 2025: Thirteen Major Events, Advancing Together - 2025 Dec
2025 has been a year of deep integration into the semiconductor industry chain and comprehensive engagement with the industrial ecosystem for Wanying Microelectronics. From Beijing to Shenzhen, spanning technology expos to talent exchanges, and from collaborative platform development to ecosystem partnerships, we have connected every link in the industry-academia-research-application chain through 13 pivotal industry events across 8 cities.
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