We offer customers full-process services for standard flip-chip (FC) and wire bonding (WB) products, ranging from substrate/leadframe design and simulation to manufacturing. Rapid turnaround packaging services are also available upon request.
Product Features
In wire bonding, metal wires are used to connect the chip pads to package leads or PCB lands. This technology offers a mature process, low cost, and high yield, and is compatible with nearly all package types.
Core Specifications
Standard leadframe size: 258mm × 78mm
Mold compound thickness: 0.75mm / 0.85mm
Standard substrate size: 240mm × 70mm
Cavity bar thickness options: 0.45mm / 0.6mm / 0.8mm / 1.0mm (appropriate thickness can be selected based on customer product thickness requirements)
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