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Home > Products > 2.5/3D Package
  • 2.5/3D Package,WanYing Chip Packaging & Testing Electronics Co., Ltd.,2.5/3D Package
  • 2.5/3D Package,WanYing Chip Packaging & Testing Electronics Co., Ltd.,2.5/3D Package

2.5/3D Package

We provide customized high-end 2.5D/3D packaging for high-density hybrid multi-chip integration.
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  • 2.5/3D Package,WanYing Chip Packaging & Testing Electronics Co., Ltd.,2.5/3D Package

Description

  Product Features  

2.5D/3D packaging provides a pathway to three-dimensional integration, enabling higher-density integration of chiplets, digital logic chips, power modules, RF system-in-package (SiP) modules, and various hybrid packages. Leveraging years of experience in R&D, product development, and manufacturing, we are able to offer high-end 2.5D/3D packaging products tailored to your requirements.

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