Pin count is often what forces a board revision late in the layout. The QFN12X12-100L answers that pressure with up to 100 no-lead contacts on a 12 mm × 12 mm body — the highest lead count in this QFN family — so a wide pad ring can close without stepping up to a larger outline. Because the contacts sit in a ring on the underside instead of on leads that reach outward, the footprint stays inside the 12 mm square and the board keeps the area a leaded outline of the same pin count would have taken. There are no leads to bend or coplanarity to check.
As a semiconductor packaging manufacturer, we build this package in our own advanced packaging facility, so the outline approved at first silicon is the outline that returns in volume. Engineers use it when the die has outgrown a smaller body but the board can still give it a 12 mm square.
| Item | Detail |
|---|---|
| Body size | 12 mm × 12 mm |
| Lead count | Up to 100 |
| Package family | Quad flat no-lead (QFN) |
| Contact style | No-lead lands, flush with the body underside |
| Mounting | Surface mount, reflow soldered |
| Interconnect | Wire-bonded leadframe |
| Body profile | Low profile |
| Thermal path | Through the lands into PCB copper |
| Assembly | Automated SMT placement and reflow |
| Typical sectors | Communications, automotive, consumer, industrial |
| Customization | Outline and lead count matched to your die |
Signal path. A no-lead body keeps the distance from die to board short, and the leadframe in this outline is arranged to hold parasitic inductance and resistance down. That matters where edges are fast and where a small amount of unwanted inductance turns into ringing or coupled noise.
Heat. The low-profile body sits flat on the board, so heat moves into the copper under the lands rather than being trapped in a tall package. In a dense assembly, planes, vias and the pad area around the footprint do most of the cooling, which is why the layout around this QFN package matters as much as the package itself.
Data for simulation. Ask our team for the electrical and thermal data we hold for this model before you run simulations; starting from the real outline saves a re-spin later.
When 100 leads is more than the design needs. If the pad ring closes well below 100 connections, the unused lands add pitch without adding function, and a smaller outline in the same family may leave more copper around the die.
When the board cannot spare 12 mm. The family also includes 10 mm and 9 mm bodies; if the layout has no room for a 12 mm square, a smaller outline can be the better fit.
When heat is the binding constraint. A die with a modest pin count but a high power budget usually benefits from more board copper around a smaller body rather than from a larger contact ring.
As an IC packaging supplier, we can confirm whether this outline fits the board.
The die, the pad ring and the board set the package, not the other way round. Our engineers go through the die, interconnect and thermal requirements with your design team before anything is built, then confirm the format and lead count that suit the board, test plan and production volume. Because design simulation, manufacturing and reliability testing sit in the same team, feasibility questions and qualification findings come back as a clear answer. As an IC packaging supplier, we also help trace yield and reliability problems back to their root cause using process data from the line that built the part.
Package selection is rarely a catalogue decision. Our engineers review your die, interconnect and thermal requirements together with your design team before anything is built, and recommend the package format and lead count that suit your board, your test plan and your production volume. Because design simulation, manufacturing and reliability testing sit within the same team, feasibility questions and qualification findings come back with a clear answer. Drawing on more than 30 years of shared packaging expertise, we also help trace yield and reliability problems back to their root cause.
The QFN12X12-100L uses a 12 mm × 12 mm body with up to 100 no-lead contacts in a surface-mount array. It carries the highest lead count in this QFN family, so it suits a wide pad ring that would not close on a 10 mm or 9 mm outline.
Yes. A 100-contact array can carry multiple supply and ground connections alongside the signal pins, which is what a dense die needs to hold a stable reference. The exact split between signal, power and ground follows your pad ring and board layout, so bring the die drawing to the review.
Yes. The outline and lead count can be matched to your die. As an IC packaging supplier, we review die fit and assembly feasibility before tooling is committed; send the pad ring and board constraints with your request so the review starts from the real layout.
Build the land pattern, solder-mask openings and stencil apertures from the current package drawing for this model, not from an earlier revision. With this QFN packaging, the contacts are flat lands under the body, so paste aperture and stencil thickness set joint thickness; the drawing is the reference for both.
When the pad ring closes below 100 connections, or the board cannot spare a 12 mm square, a smaller body in the same family can leave more copper around the die and simplify routing. This outline earns its place when pin count is the binding constraint and the layout can give it the full 12 mm footprint.
As a semiconductor packaging manufacturer, we build this package around a leadframe that carries the die, with a moulded body protecting it and no-lead contacts bringing the connections to the board. The exact material specification is proprietary, but every material is selected for electrical and thermal behaviour and checked before it enters a build. If your project carries a material restriction, raise it during the assessment.
