Development History
Wanying Beijing was established in 2016, followed by Wanying Chengdu in 2021. With a total investment of 160 million RMB, the company specializes in providing advanced packaging solutions. Our team comprises experts drawn from prestigious institutions and industry leaders, including the Chinese Academy of Sciences, the Georgia Tech 3D Systems Packaging Research Center (PRC), TI, Samsung, Tongfu Microelectronics, and Unisem. Leveraging an internationally top-tier team for packaging design and simulation—alongside robust capabilities in packaging process manufacturing—Wanying Microelectronics has established a comprehensive, one-stop service system. This system spans the entire workflow: from packaging integration schemes, design, and simulation, through manufacturing, to testing, reliability assessment, and failure analysis. From front-end conceptual design to back-end mass delivery, we utilize our professional technical expertise to ensure precision and control at every stage, thereby providing a solid guarantee for the performance realization and reliability of our clients' products.