We put 96 connections into a 10 mm × 10 mm body. This is a quad flat no-lead part: the contacts sit flush beneath the package instead of standing on formed leads, so the device lies flat on the board and each solder joint forms directly under the body.
This 96-lead qfn is aimed at high-pin-count integrated circuits — microcontrollers with wide I/O, mixed-signal front ends, power management devices that need signal pins and a solid thermal pad on the same part, and sensor hubs. Standard surface-mount reflow applies, so it runs on the same line as the rest of your board without a special process.
The footprint does not move between revisions. Layout work carries across a product family, and a design that starts on a handful of validation boards can move into series production without a package change or a new land pattern.
We build this qfn package in our own advanced packaging facility, where design simulation, manufacturing, electrical test and failure analysis sit with one team. That matters when a joint fails or a thermal reading comes in high: the people who built the part are the people who investigate it.
| Package type | QFN, quad flat no-lead |
| Body size | 10 mm × 10 mm |
| Lead count | 96 |
| Terminal style | Leadless contact array, no protruding leads |
| Mounting | Surface-mount reflow |
| Die interconnect | Wire bonding to leadframe |
| Encapsulation | Epoxy mold compound |
| Thermal path | Exposed die pad on the underside |
| Body profile | Low profile, flat underside |
| Part number | QFN023 |
A quad flat no-lead part is a leadframe package. The die is attached to a metal leadframe, wire bonded from its pads to the lead fingers and the exposed pad, then encapsulated in epoxy mold compound. The contact array is the underside of that leadframe, exposed when the parts are singulated. That construction is why the body is thin, why heat leaves mainly through the pad rather than through leads, and why the contacts sit coplanar with the body instead of formed below it.
The build parameters that decide how the part behaves later are controlled here: die attach voiding, wire bond pull and shear strength, mold flow and void content, and the flatness of the contact array after singulation. A semiconductor packaging manufacturer that leaves those to final inspection finds the problem too late; we check them in process.
Material sets — leadframe alloy, die attach, bond wire, mold compound — follow the die and the application, and are confirmed with your team during project assessment. If your program needs a declared material list or a comparison against an approved-vendor list, raise it before the build is committed so we can confirm what is available for that specific package.
The same applies to the pad finish and the mold compound grade. Those choices sit on the tooling path: they affect how long the leadframe takes to arrive and how the first build is scheduled, so they are much easier to settle at assessment than after the order is released.
Sixteen square millimeters is what this body occupies on the board. Inside that square sit 96 contacts on a fixed grid — enough for a wide bus, more than one power domain and the control lines that otherwise push a design onto a larger part or an extra board layer.
The four connections beyond 96 are the interesting question. A 12 mm × 12 mm, 100-lead qfn outline adds four contacts and takes another 44 square millimeters of board; the same 10 mm body is also built with 88 leads where the netlist is lighter and electrical performance takes priority. If 96 is exactly what your die needs, the smaller body leaves the surrounding area free for decoupling, an antenna keep-out or a second die.
Short paths help at speed. The leadless array keeps the electrical distance between die and board short, which holds parasitic inductance and resistance down compared with a leaded package at a similar pin count, and leaves more of the routing budget for the nets that actually need it.
Where several of these parts sit on one module, lot-to-lot consistency in the outline matters as much as the first-article result — which is why programs settle on an ic packaging supplier who can hold the same body dimensions and contact geometry across builds instead of reworking the land pattern every batch.
Every build runs against controlled process parameters, with inspection at die attach, wire bond, molding and singulation. When something drifts, it is caught on the line rather than at final test — the difference between a rework and a scrapped lot.
Test and analysis sit in the same facility. Electrical test screens the parts; reliability testing and failure analysis answer the harder question of why something failed. Cross-section, X-ray and thermal measurement trace a solder void or a lifted bond back to the process step that caused it, which shortens the loop between finding a fault and correcting it.
Compliance is treated as a document question rather than a slogan. We work to the standards your program requires and confirm which certificates, material declarations and inspection records can be supplied for a given build. Tell us what your quality team needs at the start of the project; the answer belongs before tooling, not after.
As a semiconductor packaging manufacturer we also cover the stages either side of the build — design simulation and DFM review before the leadframe is cut, reliability assessment and failure analysis after. Keeping a first prototype and a fifth production lot on the same set of numbers is the point of that continuity.
Why moisture matters before reflow. Epoxy mold compound draws water out of the air, and the thinner the body, the shorter the distance that water has to travel to reach the die attach and the pad interface. On a reflow profile it flashes to vapour faster than the plastic can release it, and the pressure lifts the compound off the die pad. In a bad case you see a bulge; what you do not see is delamination that becomes a void under the thermal pad or a lifted die attach after a few thermal cycles. A part can pass every electrical test here and still fail at your oven if it went in wet.
Keep it sealed until the line is ready. Parts travel in a moisture-barrier bag with desiccant and a humidity indicator card. Read the card the moment the bag is opened and write down the time — the floor life on the label counts from that moment, not from the day the box arrived. A card that has run past its limit means a bake, even if the bag looks intact.
Bake on a schedule that matches the part. If floor life has been exceeded, drive the moisture out before reflow. The right bake depends on body thickness and on the moisture level the parts are classified to, so ask us for the schedule that applies to this qfn package; an over-long bake oxidises the contact finish and costs you wetting just as surely as moisture does.
Store away from the process. Keep trays closed and off the top of the reflow oven, away from wash stations, open solvents and any spot where parts sit cold and then meet warm humid air. Condensation on a cold part is the same problem as a humid day. If you must count or pre-kit, reseal the remainder with fresh desiccant and mark the new open date on the bag.
Treat the contact side as a finished surface. The contacts are the underside of the leadframe, coplanar with the body and unprotected by any lead that could take a knock. Use a vacuum wand or soft-tip tools; metal tweezers on the pad scratch the finish and leave a site that will not wet. Do not stack trays or drop them, and check a sample for contact flatness on receipt before the lot is released to the line.
Match the reflow profile to the board, not to a reference card. Peak temperature and time above liquidus decide whether an otherwise well-stored part survives the pass. Run the profile on the actual board with its copper and thermal mass, and look under the exposed pad with X-ray rather than trusting the edge fillet. Storage control and profile control are the two halves of the same discipline that qfn packaging asks of any assembly line.
Compact module assembly in consumer electronics manufacturing calls for packaging that supports high lead density while taking up as little board space as possible. The QFN10X10-96L is built for this kind of work, with a 96-lead, 10 x 10 mm footprint and thermal characteristics suited to compact, high-performance modules. Its leadless QFN design helps reduce soldering defects and improve electrical connectivity, which matters on high-yield automated assembly lines. The package also integrates smoothly into existing manufacturing processes, making rapid design iterations and efficient volume production easier to manage. For OEMs working to tight project deadlines and stringent quality controls, this packaging approach helps keep fast-moving electronics programs on track.
Package selection is rarely a catalogue decision. Our engineers review your die, interconnect and thermal requirements together with your design team before anything is built, and recommend the package format and lead count that suit your board, your test plan and your production volume. Because design simulation, manufacturing and reliability testing sit within the same team, feasibility questions and qualification findings come back with a clear answer. Drawing on more than 30 years of shared packaging expertise, we also help trace yield and reliability problems back to their root cause.
It is a leadframe construction: the die is attached to a metal leadframe, wire bonded to the lead fingers and the exposed pad, then encapsulated in epoxy mold compound, with the underside of that leadframe forming the contact array. The exact alloy, die attach and mold compound grade follow the die and the application, so they are confirmed during assessment rather than fixed for every build. If you need a declared material list for this qfn package, ask before the build is committed and we will confirm what can be supplied.
Yes. We accept customization requests and evaluate them through project assessment: send the design modifications you have in mind — contact layout, thermal pad, material set or test requirements — and our engineers will confirm feasibility and what it means for tooling. Requests that touch the leadframe affect schedule most, so they are worth raising early. Tailored qfn packaging is part of what we do, but the answer is always specific to your project rather than a blanket yes.
There are no formed leads to bend and no coplanarity errors to chase, so open joints from deformed leads drop off the defect list. The joint forms directly beneath the body, which shortens the electrical path and reduces the parasitic effects a leaded package brings at the same pin count. Mechanically the part lies flat against the board with the thermal pad anchored to copper, so it copes with thermal cycling and board flex better than a package standing on leads. Assembly still depends on paste volume and reflow profile — the design removes one class of failure rather than all of them, and a semiconductor packaging manufacturer who controls contact flatness is what gives that design room to work.
Anything that needs a lot of I/O in a small square: compact consumer modules, sensor hubs, mixed-signal front ends, power management devices and instrument front ends. It also suits validation boards, where a fixed body size keeps measurements comparable across builds. Where the netlist is lighter, the 88-lead version of the same body may serve you better; where four more connections are needed, the 12 mm, 100-lead outline is the step up. Raise the pad ring and netlist with an ic packaging supplier early and the fit can be confirmed before layout freeze.
Keep them in the sealed moisture-barrier bag with its desiccant and humidity indicator card until the line is ready, and observe the floor life marked on the label. If that time has been exceeded, bake according to the handling instruction supplied with the parts before reflow. Handle with vacuum or soft-tip tools rather than metal tweezers on the contact side, and keep the exposed pad clean — contamination there shows up as voiding under the pad.
Yes. The pad on the underside is the main thermal path and is normally soldered to board copper, with thermal vias carrying heat into the inner layers. Many designs also use it as a ground connection; confirm that against your own netlist and stack-up, because the electrical role of the pad is a design decision rather than a package limitation. Solder it with the same care you give the signal contacts — an unsoldered or voided pad gives up most of the thermal benefit of the outline.
