The QFN9X9-80L is a 9 mm × 9 mm quad flat no-lead package carrying 80 contacts on a leadless, surface-mount body. It is the smallest outline in our QFN range, and it exists for one reason: to give a die with a dense pad ring somewhere to land without pushing the board layout wider than the product can afford.
Chip designers and package engineers usually reach for this size when the board is already tight. Microcontroller units, power management ICs and communication devices are the three most common fits. A leaded package extends its pins past the body and eats board area the design does not have; in this qfn package the contacts sit as pads on the underside, so the device occupies exactly the square it needs and the electrical path from die to board stays short.
Build and test both happen in our own advanced packaging facility, and as a semiconductor packaging manufacturer we hold the leadframe, assembly and inspection steps under one quality system rather than passing work between subcontractors. If your design is still at pad-ring stage, send the die outline and the application, and our engineers will confirm whether this outline suits it before you commit a layout.
| Property | Value |
|---|---|
| Package family | QFN package, leadless surface mount |
| Body size | 9 mm × 9 mm |
| Lead count | 80 contacts, no-lead pads on the underside |
| Die connection | Wire bonding to the leadframe |
| Encapsulation | Epoxy mould compound, flat body |
| Thermal path | Exposed die pad for board-side heat spreading |
| Mounted profile | Low-profile, leadless |
| Assembly method | Automated pick-and-place and reflow |
| Board interface | Solder pads under the body, thermal pad to copper |
| Inspection | Optical check of the contact ring, thermal pad verified |
The build starts with a metal leadframe. It is the skeleton that carries the die, forms the pad array on the underside and moves heat and current between the two; the alloy is chosen to match the thermal and mechanical demands of the programme. The die is attached to the die pad, wired from its bond pads to the lead fingers, and then encapsulated in epoxy mould compound that forms the flat body around it.
Moulding is where a leadless package earns or loses its flatness. The compound has to fill the cavity evenly, leave every contact pad clean and keep the underside coplanar, so that all 80 pads meet their solder deposits at the same moment. A body that is not flat will rock on the paste during placement, and no stencil design will rescue that afterwards.
The die pad stays exposed through the moulding. That exposed face is both the thermal route and the electrical ground connection to the board, so its flatness and cleanliness matter as much as the contact ring. Wire bonding joins die to lead fingers, with loop height and bond placement controlled so the wires clear the moulding flow without touching each other.
As an ic packaging supplier we qualify the material set — leadframe alloy, die attach, bond wire and mould compound — against the reliability level the programme needs, and we review your die drawing before tooling so that pad ring, die thickness and body size line up. Where a design calls for something outside the standard build, raise it at assessment so the process window can be checked before anything is committed.
Control runs through the build rather than sitting at the end of it. Incoming material is checked, process parameters are held inside their window, and finished parts are inspected against the drawing before they leave. Because assembly, test and failure analysis sit inside the same team, a lot that behaves differently from the one before it is investigated with process data from the line that made it, not with a report from a third party.
As an ic packaging supplier we work to documented quality and compliance standards, and the certificates behind them are the ones we publish in our compliance documentation. Which of those documents your programme actually needs depends on the end application — an industrial control board and an automotive module rarely ask for the same evidence — so it is easier to agree the list at the start of a project than to assemble it after qualification.
When something goes wrong, the route is failure analysis: the part is examined, the failure mode identified and the finding fed back into the process. For devices going into safety-related or long-life products, ask for the analysis record with your lot.
Package selection is rarely a catalogue decision. Our engineers review your die, interconnect and thermal requirements together with your design team before anything is built, and recommend the package format and lead count that suit your board, your test plan and your production volume. Because design simulation, manufacturing and reliability testing sit within the same team, feasibility questions and qualification findings come back with a clear answer. Drawing on more than 30 years of shared packaging expertise, we also help trace yield and reliability problems back to their root cause.
The advantage of a qfn package at this size is the ratio between connections and board area: 80 contacts inside a 9 mm square, the smallest footprint in our range. That means a dense pad ring can be carried on a board that has no room for a 10 mm or 12 mm body, while the leadless construction keeps the die-to-board path short and gives the heat a direct route into the copper underneath.
The 9 mm × 9 mm 80-contact body is a standard outline, and for most programmes it is the right starting point. Where a die needs a different pad arrangement, die thickness or reliability level, our engineers will review it with you and say plainly what can be adjusted within the process and what would call for a different package. Custom qfn packaging conversations are recommended at the assessment stage, before tooling is committed.
The body is flat, leadless and free of protruding pins, so it feeds through pick-and-place and reflows like any standard surface-mount part. Placement relies on vision and fiducials rather than mechanical lead guidance, the flat top gives the nozzle a consistent pickup surface, and the contacts pull themselves into alignment during reflow. That combination reduces manual handling and keeps placement repeatable from lot to lot, which is what throughput on a volume line actually depends on.
Our quality system is documented and every build is inspected against the drawing before it ships. As an ic packaging supplier we keep the certificates and compliance documents current and can supply them with a quotation or a tender pack. The evidence a programme needs varies — an industrial controller and an automotive module rarely ask for the same list — so tell us what your quality department requires and we will confirm exactly what applies to this build.
The 10 mm × 10 mm outlines carry 88 and 96 contacts and give the die more room, and the 12 mm × 12 mm part goes up to 100. If your pad ring fits the 80-contact arrangement, the 9 mm body gives you the smaller board footprint; if you need a handful more connections, moving up one size costs less board area than adding a second package. The assembly process stays the same across all three, so an outline chosen today can be revisited later without reworking the line.
Three things decide how well the package performs on your board: the pad geometry, the copper area and via arrangement under the thermal pad, and the stencil aperture that prints onto both. Send your proposed land pattern with the die drawing and our engineers will review it before the board goes to fabrication. Changes at that stage cost a layout revision; changes after fabrication cost a board spin.
Yes — automotive electronic modules and industrial control assemblies are two of the sectors this outline serves most often. What differs between programmes is the reliability evidence required, so the test plan is agreed with your engineering team at assessment instead of being assumed from the package. As a semiconductor packaging manufacturer we build to the agreed plan and return the results as part of the qualification record.
