Product Features
To meet different package I/O interconnect requirements, we can design and manufacture reliable connection solutions tailored to your specifications, ensuring robust and stable product performance.
BGA (Ball Grid Array)
Solder ball array on the bottom side. Offers extremely high I/O density (thousands of pins), short signal paths, low parasitic inductance, and self-alignment of solder balls during assembly for ease of manufacturing. Ideal for CPUs, GPUs, and FPGAs.
LGA (Land Grid Array)
Metal land pads on the bottom side without solder balls. Eliminates the risk of pin deformation, provides uniform contact pressure across the plane, and offers better thermal dissipation. Commonly used in high-end processors and server chips.
PGA (Pin Grid Array)
Ceramic or plastic substrate with pluggable pins. Enables easy insertion/removal and convenient rework, with robust mechanical connection strength. Commonly seen in legacy workstation CPUs and ruggedized military/aerospace chips.
