Product Features
Leadframe packaging is the most mainstream non-hermetic packaging format in the semiconductor industry. It uses a copper or iron-nickel alloy leadframe as the substrate, achieves electrical connection between the chip and the leads through wire bonding, and encapsulates the entire assembly with epoxy molding compound to form package families such as SOT, SOP, QFP, and QFN. This packaging technology offers low cost, mature processes, and suitability for high-volume production. Its reliability has already met industrial and automotive-grade requirements, making it widely used in consumer electronics, automotive electronics, industrial control, and other fields.
