Product Features
Microelectronic devices are classified into hermetic and non-hermetic packaging based on their sealing method. High-reliability integrated circuits and discrete components typically employ hermetic packaging using metal, ceramic, or glass materials, featuring an internal cavity structure filled with high-purity nitrogen or other inert gases. Hermetically packaged components offer significantly higher reliability than their non-hermetic counterparts. They are subject to stricter control standards in design, manufacturing, testing, and inspection, resulting in a lower failure rate. As such, hermetic packaging is predominantly used in high-reliability application domains.
