2025 has been a year of deep integration into the semiconductor industry chain and comprehensive engagement with the industrial ecosystem for Wanying Microelectronics. From Beijing to Shenzhen, spanning technology expos to talent exchanges, and from collaborative platform development to ecosystem partnerships, we have connected every link in the industry-academia-research-application chain through 13 pivotal industry events across 8 cities. With each connection, we have accumulated momentum for innovation, and with every dialogue, we have expanded the horizons of collaboration. Now, let us revisit this annual event chronicle together and relive those shining moments of idea exchange and the seeds of partnership.
April · Xi'an
Western Semiconductor Industry Innovation Development Forum & 20th Anniversary Conference of Shaanxi Semiconductor Industry Association
The conference focused on design innovation, manufacturing, packaging and testing in the semiconductor industry chain, as well as the current status and development trends of semiconductor applications and intelligent equipment. Wanying Micro attended with exhibition products and delivered a keynote speech on RF-Chiplet, which received enthusiastic responses at the event.
August · Chengdu
Visit to Sichuan Ultra-High Definition Video Industry Alliance
Targeting the specific packaging requirements of ultra-high definition video CMOS chips, the company engaged in technical exchanges with alliance members to provide customized packaging solutions for related chips.
September · Chengdu
Overseas Talent Project Introduction Achievement Exhibition
The exhibition focused on technological innovation and the commercialization of research outcomes by overseas returnees. Wanying Microelectronics comprehensively demonstrated and exchanged insights on its capabilities in addressing 'bottleneck' technologies in the integrated circuit packaging industry, major process innovations, and patented achievements.
September · Shenzhen
Shenzhen International Semiconductor Exhibition & 2025 Integrated Circuit Industry Innovation Exhibition (SEMI-e)
Wanying Microelectronics' exhibition team engaged in technical exchanges and business discussions with industry experts, clients, and partners from around the world. Shi Xianyu, the company's Vice President of R&D, conducted an on-site media interview, delving into discussions about the company's products, development trends in the semiconductor packaging and testing industry, and directions for technological innovation.
September · Mianyang
The 13th China (Mianyang) Science and Technology City International Science and Technology Expo
During the exhibition, Wanying Microelectronics highlighted its specialized chip packaging technologies for key national sectors such as aerospace, smart manufacturing, and the Internet of Things (IoT), with a particular focus on recent breakthroughs in high-reliability packaging and solutions for extreme environmental conditions.
October · Chengdu
Chengdu High-tech Zone's 'Two-way Engagement Pilot Platform Series Event' – Entering Southwest Jiaotong University
Wanying Micro visited the university, engaging in in-depth discussions with five research teams from Southwest Jiaotong University on six technology transfer projects, and reached preliminary cooperation intentions.
November · Nantong
The 10th China Aviation Innovation and Entrepreneurship Competition
Wanying Micro stood out among 431 national entries with its System-in-Package (SiP) technology for satellite communication RF modules, winning the 'Popular Star Award,' 'Third Prize in the Entrepreneurship Category,' and 'Second Prize in the Future Space Sector Competition.'
November · Shenzhen
The 27th China International High-Tech Fair (CHTF)
Wanying Micro showcased its latest technological achievements at CHTF. Li Kezhong, the company's Executive Vice General Manager, delivered a keynote speech, attracting significant attention from industry experts and partners.
November · Chengdu
Integrated Circuit Development Forum (Chengdu-Chongqing) & the 31st Integrated Circuit Design and Application Exhibition (ICCAD-Expo)
Wanying Micro drew considerable attention by presenting its core technologies at ICCAD-Expo. The company exchanged insights with over 300 professional visitors and industry experts at its booth, reaching preliminary cooperation agreements.
November · Beijing
The 22nd China International Semiconductor Expo (IC China)
Wanying Micro unveiled major new products at IC China. Dr. Sun Yu, the company's General Manager, hosted a product launch focused on RF System-in-Package (SiP), optoelectronic co-packaging, and high-reliability packaging technologies, becoming one of the highlights of the event.
November · Chengdu
'Tianfu Science and Technology · Smart Chengdu – Innovating the Future' Science and Technology Achievement Matchmaking Event (Electronics and Information Sector Session)
The event centered on collaborative innovation and technology transfer in the integrated circuit industry. Wanying Micro shared its achievements in advanced packaging and testing technologies and established cooperative intentions with several local chip design companies from the southwestern region in attendance.
November · Sichuan
China-Korea Semiconductor Enterprise Symposium
Wanying Micro engaged in in-depth discussions with visiting Korean semiconductor design companies, promoting deeper collaboration between Chinese and Korean enterprises in chip R&D, supply chain coordination, and market expansion.
December · Shanghai
Chengdu High-tech Zone Pilot Platform 'Go Global' Special Event – Shanghai Session
The meeting aimed to leverage the synergy between the eastern frontier and the western hinterland in technological innovation for integrated circuits. At the event, our company, as a representative of outstanding pilot platforms, delivered a speech. Li Kezhong, Executive Vice General Manager, shared insights on the platform’s positioning, core technologies, and service capabilities with the attendees.
We extend our sincere gratitude to all partners for their trust and companionship. In 2025, we navigated an industrial journey filled with challenges and opportunities together. Every industry event, technical exchange, and cooperative agreement has been an indispensable pillar on Wanying Microelectronics’ path of growth. Looking ahead to 2026, Wanying Microelectronics will uphold the values of 'Professionalism, Quality, Customer Focus, Integrity, and Innovation,' continuously deepening our efforts in technology R&D, quality control, and customer service. We will respond to every act of trust with professionalism and innovation.
