RF-SiP

  Product Features  

• Packaging Technology: Molded PoP (Package-on-Package) solution integrating high-frequency vertical interconnect posts to enable 3D stacked architecture.
• Operating Band: X-band (supports four-channel T/R module integration).
• Package Dimensions: 14.5mm × 14.5mm – compact design enabling high-density integration of RF front-ends.
• Integration Scale: >30 active chips + >100 passive resistors and capacitors integrated within a single package.
• Transmit Power: >2W output power per branch (>8W total across four channels).
• Receive Performance: Minimized receive channel design achieves low noise figure and significantly improves receiver link sensitivity.
• Isolation: Through rigorous simulation and process optimization, perfectly addresses crosstalk between channels, between transmitter and receiver, and between front-end and back-end stag

  Process Highlights  

•  Utilizes advanced molded PoP (Package-on-Package) technology combined with high-frequency vertical interconnect posts to achieve low-loss, short-path RF signal transmission.
• Integrates over 130 various components within a compact 14.5mm × 14.5mm package, significantly reducing the footprint of the RF front-end to meet system miniaturization requirements.
• Optimized thermal dissipation structure and layout design ensure thermal reliability of the transmit chain under high-power output conditions.
• Full-link electromagnetic simulation and process validation effectively suppress electromagnetic coupling interference across multiple channels, ensuring consistent transmit/receive performance.