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PMFA-23
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1
2
FEATURED
Design & Simulation
Design & Simulation 001
WB (Wire Bond)
WB (Wire Bond)
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FC (Flip Chip)
M(ixed)I(nterconnets)Package
M(ixed)I(nterconnets)Package
2.5/3D Package
2.5/3D Package
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Cerimic/Metal Package
CSP（Chip Scale Package）
CSP（Chip Scale Package）
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BGA/LGA/PGA
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