DFN is an advanced electronic packaging technology within the category of electronic components. ON Semiconductor was the first company to adopt this technology and apply it to various devices. This packaging employs a dual-flat or square flat no-lead (DFN/QFN) structure, belonging to the surface mount technology field. It requires that the installation pads, solder mask, and stencil design on printed circuit boards (PCBs) adhere to specific assembly principles. Its package structure supports one or multiple semiconductor devices being interconnected within a lead-free package, offering design flexibility and high-density characteristics.
