• CSP,WanYing Chip Packaging & Testing Electronics Co., Ltd.,2.5/3D Package
  • CSP,WanYing Chip Packaging & Testing Electronics Co., Ltd.,2.5/3D Package

CSP

We supply versatile customized QFN packaging with diverse substrates, stacked structures and abundant standard size specifications.
  • CSP,WanYing Chip Packaging & Testing Electronics Co., Ltd.,2.5/3D Package

Description

  Product Features  

Our QFN (Quad Flat No‑lead) packages offer a small footprint, excellent electrical performance, and superior thermal dissipation. They can also be combined with BGA and PoP (Package‑on‑Package) configurations. Substrate options are flexible — available as leadframe‑based, organic substrate‑based, or ceramic substrate‑based. We also provide customized small‑outline leadframe‑based packaging products.


Available QFN types include:

3030‑12L, 3030‑16L, 3540‑16L, 4040‑16L, 4040‑24L, 4040‑28L, 5050‑20L, 5050‑28L, 5050‑32L, 6060‑40L, 6090‑16L, 7070‑48L, 7070‑60L, 7070‑68L, 9090‑64L.

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