QFP (Quad Flat Package) is a square flat package technology (Chinese name), which is a surface-mount integrated circuit packaging form with gull-wing leads on all four sides. Its lead pitch can be as low as 0.3mm, with a maximum of up to 304 leads, primarily using plastic as the packaging material, with ceramic and metal materials also available . This technology, characterized by its small size and low parasitic parameters, is widely used in microprocessors, digital logic circuits, and high-frequency applications . It is categorized into standard type (2.0-3.6mm), thin LQFP (1.4mm), and ultra-thin TQFP (1.0mm) based on body thickness. Bending issues are prone to occur when the lead pitch is less than 0.65mm; improved versions include buffered BQFP and heat-dissipating enhanced HQFP . The QFP packaging process includes solder paste printing, component placement welding, X-ray inspection, and other procedures, requiring a pass rate of over 99.5%.
