News

We are pleased to share a milestone achievement in technological innovation—after persistent efforts by our engineering team, we have successfully independently developed a high-efficiency die sorting function on existing equipment platforms. For the first time, we have realized a fully automated die sorting process from blue film to vacuum release boxes, marking a substantial breakthrough in our packaging process optimization!

At 7 a.m., your phone alarm rings on time. As you drowsily press the stop button, you likely never imagine the invisible mechanical battle unfolding inside the smooth, flat device in your hand. The chip and its packaging structure are subjected to complex mechanical stresses

2025 has been a year of deep integration into the semiconductor industry chain and comprehensive engagement with the industrial ecosystem for Wanying Microelectronics. From Beijing to Shenzhen, spanning technology expos to talent exchanges, and from collaborative platform development to ecosystem partnerships, we have connected every link in the industry-academia-research-application chain through 13 pivotal industry events across 8 cities.