Product Features
Co-packaged optics involves silicon photonics chips, lasers, drivers, transimpedance amplifiers (TIAs), thermal management, and optical coupling structures — encompassing heterogeneous and heterointegration, making it one of the most challenging integration technologies. Leveraging years of experience in this field, we provide customers with the highest level of technical services in China — from CPO solution development, module design and simulation, electro-thermal and mechanical design and simulation, to precision process manufacturing — ensuring fast product delivery.
